laser cutting and engraving machine, laser engraver

Fiber Laser Scribing Machine
LDF-25
HGL-LDF25 Laser scribing machine is adopted 20W fiber laser with optics isolation system. It has high stability and good optical quality, which is advanced than traditional lamp-pumped laser. Its 10.64nm laser wavelength could scribe on silicon battery, which with significant advantages compare with traditional lamp pumped laser source.

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Highlights

Good laser beam quality
Low running cost
Free maintenance
Compact dimension
Easy operation and strong function professional scribing software

Characterisitics

The edge of scribing line is smooth, could avoid small cracks by knife cutting and upgrade production quality.
High working efficiency, the scribing speed is 1.5-2 times faster than lamp pumped laser.
Because laser is utilized instantaneous high temprature to work on material surface, its hot influencing area is small and there is no impurity to remain, with high optical transmitting efficiency.
Non-contact process method, , it has no pollution for environment

To scribe or cutting the cell or wafer of Monocrystalline Silicon, Silicon Polycrystal Silicon, amorphous siliconin solar industry; To scribe the thin film amprphous silicon battery; Substrate The rowing slice and cutting of semi conductor substrate materials such as electron trade silicon, germanium, the GaAs etc...

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Technical Specifications
Model No	LDF25
Laser	25W
Wavelength	1064 m
Average outpur power	<20W
Power debugging range	0~100%
Marking Area	F=160mm, 110mm x 110mm
Max. linear marking speed	7000mm/s
Min. marking line width	0.02mm
Min. character size	0.2mm
Marking depth	0.01~0.2mm (according to material)
Min. laser focus ebeam diameter	0.02mm
Max. scribing speed	1000mm/s
Power	1KV/AC220V/50Hz
Cooling system	Air cooling
Electric moving tabel moving journey	300 x 300 mm (strp motor system)
Specifications are subject to change without notice